Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 10, 2019
Patent Application Number
15383974
Date Filed
December 19, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for manufacturing a semiconductor device is described that comprises providing a substrate, forming a plurality of fins having a first semiconductor material, replacing a first portion of at least one of the fins with a second semiconductor material, and distributing the second semiconductor material from the first portion to a second portion of the at least one of the fins.
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