US Patent 10510687 Packaging devices and methods for semiconductor devices
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Patent abstract
Packaging devices and methods for semiconductor devices are disclosed. In some embodiments, a packaging device for a semiconductor device includes a packaging substrate including a semiconductor device mounting region. The packaging device includes a stress isolation structure (SIS) disposed on the packaging substrate proximate a portion of a perimeter of the semiconductor device mounting region.
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Is a
Patent Applicant
Patent Jurisdiction
Patent Number
105106870
Date of Patent
December 17, 2019
0Patent Application Number
162252350
Date Filed
December 19, 2018
0Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Patent Jurisdiction
Patent Number
105106870
Date of Patent
December 17, 2019
0Patent Application Number
162252350
Date Filed
December 19, 2018
0Patent Primary Examiner
Edits on 31 Jan, 2022
Golden AI
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US Patent 10510687 Packaging devices and methods for semiconductor devices
Infobox
Is a
Patent applicant
Patent jurisdiction
Patent number
10510687
Date of patent
December 17, 2019
Patent application number
16225235
Date Filed
December 19, 2018
Patent primary examiner
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