US Patent 10510861 Gaseous spacer and methods of forming same
Patent 10510861 was granted and assigned to Taiwan Semiconductor Manufacturing Company on December, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 15, 2018
Date of Patent
December 17, 2019
Patent Applicant
Patent Application Number
16010061
Patent Citations Received
Patent Inventor Names
Hsin-Hao Yeh
0
Ching Yu Huang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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