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US Patent 10515886 Scalable semiconductor interposer integration
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Patent
Date Filed
November 11, 2017
Date of Patent
December 24, 2019
Patent Application Number
15810050
Patent Citations Received
US Patent 11942442 Package structure and manufacturing method thereof
0
US Patent 11640935 Semiconductor package and manufacturing method thereof
0
US Patent 11302617 Scalable semiconductor interposer integration
US Patent 11488902 Split substrate interposer
US Patent 10840197 Package structure and manufacturing method thereof
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10515886
Patent Primary Examiner
Yuriy Semenenko
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