Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Wei Lin0
Ching-Hua Hsieh0
Ming-Da Cheng0
Shing-Chao Chen0
Tsung-Hsien Chiang0
Date of Patent
December 24, 2019
Patent Application Number
16222047
Date Filed
December 17, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A chip package is provided. The chip package includes a semiconductor die and a protection layer surrounding the semiconductor die. The chip package also includes a dielectric layer over the semiconductor die and the protection layer. The dielectric layer has an upper surface with cutting scratches. The chip package further includes a conductive layer over the dielectric layer and filling some of the cutting scratches.
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