Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 2, 2022
Patent Application Number
16725352
Date Filed
December 23, 2019
Patent Citations
Patent Citations Received
Patent Primary Examiner
A chip package is provided. The chip package includes a semiconductor die and a protection layer surrounding the semiconductor die. The chip package also includes a first dielectric layer over the semiconductor die and the protection layer. The first dielectric layer has an upper surface with cutting scratches. The chip package further includes a conductive layer over the first dielectric layer. In addition, the chip package includes a second dielectric layer over the conductive layer and filling some of the cutting scratches. Bottoms of the cutting scratches are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die.
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