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US Patent 10522408 FinFET device and method of forming same
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Patent
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Date Filed
December 21, 2018
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Date of Patent
December 31, 2019
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
16228924
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Patent Citations Received
US Patent 11374127 Multi-layer film device and method
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US Patent 10727350 Multi-layer film device and method
US Patent 10840134 Interconnect structure and method
US Patent 11328952 Interconnect structure and method
US Patent 11777035 Multi-layer film device and method
Patent Inventor Names
Yi-Wei Chiu
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Chih-Shan Chen
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Chih-Teng Liao
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Tzu-Chan Weng
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Ying Ting Hsia
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10522408
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Patent Primary Examiner
George R Fourson, III
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