US Patent 10535597 Semiconductor structure and manufacturing method thereof

The present disclosure provides a semiconductor package device, which includes an interposer die. The interposer die includes a semiconductor substrate and a plurality of through-silicon-vias (TSVs) extending through the semiconductor substrate. The semiconductor package device also includes a semiconductor die spaced apart from the interposer die, a first redistribution layer disposed on a first side of the interposer die and electrically coupling the interposer die with the semiconductor die, and a second redistribution layer on a second side of the interposer die opposite the first side.