Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shuo-Mao Chen0
Chewn-Pu Jou0
Feng Wei Kuo0
Date of Patent
March 19, 2024
0Patent Application Number
177086660
Date Filed
March 30, 2022
0Patent Primary Examiner
CPC Code
Patent abstract
An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.
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