Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Manish Dubey0
Patrick Nardi0
Rajendra C. Dias0
Srikant Nekkanty0
Date of Patent
January 14, 2020
Patent Application Number
15548741
Date Filed
February 12, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic package that includes a substrate and a die attached to the substrate. The electronic package further includes a stiffener that is attached to the substrate adjacent to the die. The stiffener is formed of a first layer made from one material and a second layer made from a different material.
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