US Patent 10535615 Electronic package that includes multi-layer stiffener
Patent 10535615 was granted and assigned to Intel on January, 2020 by the United States Patent and Trademark Office.
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Patent abstract
An electronic package that includes a substrate and a die attached to the substrate. The electronic package further includes a stiffener that is attached to the substrate adjacent to the die. The stiffener is formed of a first layer made from one material and a second layer made from a different material.
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Patent Inventor Names
Manish Dubey0
Patrick Nardi0
Rajendra C. Dias0
Srikant Nekkanty0
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US Patent 10535615 Electronic package that includes multi-layer stiffener
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10535615
Date of patent
January 14, 2020
Patent application number
15548741
Date Filed
February 12, 2016
Patent primary examiner
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