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US Patent 10541156 Multi integrated circuit chip carrier package
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Patent
Date Filed
October 31, 2018
Date of Patent
January 21, 2020
Patent Application Number
16176167
Patent Citations Received
US Patent 10978314 Multi integrated circuit chip carrier package
US Patent 11804468 Manufacturing method of semiconductor package using jig
US Patent 11705676 Method and apparatus for tracking a life cycle of turbocharger
0
US Patent 11973058 Multiple die assembly
0
US Patent 11410905 Optimized weight heat spreader for an electronic package
US Patent 10950520 Electronic package, method for fabricating the same, and heat dissipator
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10541156
Patent Primary Examiner
Asok K Sarker
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