Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yen Hsiang Chew0
Date of Patent
February 4, 2020
0Patent Application Number
160867120
Date Filed
April 28, 2016
0Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.
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