US Patent 10553520 Electronic apparatus
Patent 10553520 was granted and assigned to Sony Interactive Entertainment on February, 2020 by the United States Patent and Trademark Office.
All edits
Edits on 30 Oct, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 11 Dec, 2023
Golden AI
Edits made to:
Article (+434 characters)
Article
Patent abstract
A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
Edits on 5 Oct, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Golden AI
Edits made to:
Infobox (+5 properties)
Infobox
Patent Inventor Names
Hiroaki Tsurumi0
Hitomi Iizuka0
Kenji Hirose0
Shinya Tsuchida0
Yuta Tamaki0
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
105535200
Date of Patent
February 4, 2020
0Patent Application Number
155591110
Date Filed
April 4, 2016
0Patent Citations Received
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Patent Citations Received
Edits on 11 Feb, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
Edits on 1 Feb, 2022
Golden AI
Edits made to:
Infobox (+9 properties)
US Patent 10553520 Electronic apparatus
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10553520
Date of patent
February 4, 2020
Patent application number
15559111
Date Filed
April 4, 2016
Patent primary examiner
Find more entities like US Patent 10553520 Electronic apparatus
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
