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US Patent 10553522 Semiconductor microcooler
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Date Filed
August 13, 2018
Date of Patent
February 4, 2020
Patent Application Number
16102252
Patent Citations Received
US Patent 12029010 Water block having hollow fins
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US Patent 11967538 Three dimensional IC package with thermal enhancement
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US Patent 11990386 Methods and heat distribution devices for thermal management of chip assemblies
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US Patent 11988471 Devices and methods for fabrication of components of a multiscale porous high-temperature heat exchanger
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US Patent 11600548 Methods and heat distribution devices for thermal management of chip assemblies
US Patent 11859921 Microtube heat exchanger
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US Patent 11955406 Temperature control element utilized in device die packages
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10553522
Patent Primary Examiner
Karen Kusumakar
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