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US Patent 11967538 Three dimensional IC package with thermal enhancement

Patent 11967538 was granted and assigned to Google on April, 2024 by the United States Patent and Trademark Office.

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Patent abstract

An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.

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