US Patent 11967538 Three dimensional IC package with thermal enhancement
Patent 11967538 was granted and assigned to Google on April, 2024 by the United States Patent and Trademark Office.
All edits
Edits on 24 Apr, 2024
Golden AI
Edits made to:
Infobox (+21 properties)
Article (+495 characters)
US Patent 11967538 Three dimensional IC package with thermal enhancement
Article
Patent abstract
An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Madhusudan K. Iyengar0
Teckgyu Kang0
Woon-Seong Kwon0
Xiaojin Wei0
Date of Patent
April 23, 2024
0Patent Application Number
172261770
Date Filed
April 9, 2021
0Patent Citations
Patent Primary Examiner
Find more entities like US Patent 11967538 Three dimensional IC package with thermal enhancement
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
