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US Patent 8299608 Enhanced thermal management of 3-D stacked die packaging

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

82996080

Patent Inventor Names

David R. Motschman0

Jamil A. Wakil0

Jiantao Zheng0

Kamal K. Sikka0

Xiaojin Wei0

Gerald K. Bartley0

Date of Patent

October 30, 2012

Patent Application Number

128327320

Date Filed

July 8, 2010

Patent Citations Received

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US Patent 11990386 Methods and heat distribution devices for thermal management of chip assemblies

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US Patent 11887908 Electronic package structure with offset stacked chips and top and bottom side cooling lid

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US Patent 11955406 Temperature control element utilized in device die packages

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US Patent 11967538 Three dimensional IC package with thermal enhancement

Patent Primary Examiner

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Dao H Nguyen

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