US Patent 8299608 Enhanced thermal management of 3-D stacked die packaging
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Patent Inventor Names
David R. Motschman0
Gerald K. Bartley0
Jamil A. Wakil0
Jiantao Zheng0
Kamal K. Sikka0
Xiaojin Wei0
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US Patent 08299608 Enhanced thermal management of 3-D stacked die packaging US Patent 8299608 Enhanced thermal management of 3-D stacked die packaging
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Patent Number
082996080
Patent Number
82996080
Edits on 24 Sep, 2022
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Is a
Patent Jurisdiction
Patent Number
082996080
Date of Patent
October 30, 2012
0Patent Application Number
128327320
Date Filed
July 8, 2010
0Patent Primary Examiner
Edits on 15 Dec, 2021
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US Patent 08299608 Enhanced thermal management of 3-D stacked die packaging
Infobox
Is a
Patent jurisdiction
Patent number
08299608
Date of patent
October 30, 2012
Patent application number
12832732
Date Filed
July 8, 2010
Patent primary examiner
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