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US Patent 10553526 Semiconductor package
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Patent
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Date Filed
March 16, 2017
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Date of Patent
February 4, 2020
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Patent Application Number
15460583
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Patent Citations Received
US Patent 11557560 Semiconductor package for improving reliability
US Patent 11804443 Segregated power and ground design for yield improvement
Patent Inventor Names
Ta-Jen Yu
0
Wen-Sung Hsu
0
Tzu-Hung Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10553526
0
Patent Primary Examiner
Peniel M Gumedzoe
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