US Patent 10553675 Isolation of semiconductor device with buried cavity
Patent 10553675 was granted and assigned to Infineon Technologies on February, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 17, 2017
Date of Patent
February 4, 2020
Patent Applicant
Patent Application Number
15785627
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 10553675 Isolation of semiconductor device with buried cavity
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
