Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 4, 2020
Patent Application Number
16169955
Date Filed
October 24, 2018
Patent Citations
Patent Primary Examiner
Patent abstract
A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.
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