US Patent 10555438 Heat dissipation structure and electronic device having the same
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Patent abstract
A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.
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Patent Jurisdiction
Patent Number
105554380
Date of Patent
February 4, 2020
0Patent Application Number
161699550
Date Filed
October 24, 2018
0Patent Citations
Patent Primary Examiner
Edits on 27 Sep, 2022
Golden AI
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Infobox
Is a
Patent Jurisdiction
Patent Number
105554380
Date of Patent
February 4, 2020
0Patent Application Number
161699550
Date Filed
October 24, 2018
0Patent Citations
Patent Primary Examiner
Edits on 1 Feb, 2022
Golden AI
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US Patent 10555438 Heat dissipation structure and electronic device having the same
Infobox
Is a
Patent jurisdiction
Patent number
10555438
Date of patent
February 4, 2020
Patent application number
16169955
Date Filed
October 24, 2018
Patent citations
Patent primary examiner
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