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US Patent 10559461 Selective deposition with atomic layer etch reset

Patent 10559461 was granted and assigned to Lam Research on February, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Lam Research
Lam Research
Date Filed
April 28, 2017
Date of Patent
February 11, 2020
Patent Applicant
Lam Research
Lam Research
Patent Application Number
15581951
Patent Citations
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US Patent 10186426 Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)
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US Patent 10043656 Selective growth of silicon oxide or silicon nitride on silicon surfaces in the presence of silicon oxide
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US Patent 10176984 Selective deposition of silicon oxide
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US Patent 10199212 Selective growth of silicon oxide or silicon nitride on silicon surfaces in the presence of silicon oxide
Patent Citations Received
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US Patent 11404275 Selective deposition using hydrolysis
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US Patent 10727073 Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces
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US Patent 10825679 Selective growth of SIO2 on dielectric surfaces in the presence of copper
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US Patent 10832909 Atomic layer etch, reactive precursors and energetic sources for patterning applications
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US Patent 10903071 Selective deposition of silicon oxide
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US Patent 10998187 Selective deposition with atomic layer etch reset
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Patent Inventor Names
Nagraj Shankar
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Kapu Sirish Reddy
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Karthik Sivaramakrishnan
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Meliha Gozde Rainville
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David Charles Smith
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David W. Porter
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Dennis M. Hausmann
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10559461
Patent Primary Examiner
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Mohammad M Choudhry

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