US Patent 10586763 Semiconductor device and method of manufacture
Patent 10586763 was granted and assigned to Taiwan Semiconductor Manufacturing Company on March, 2020 by the United States Patent and Trademark Office.
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Patent abstract
An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.
Edits on 26 Apr, 2023
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
105867630
Date of Patent
March 10, 2020
0Patent Application Number
159665580
Date Filed
April 30, 2018
0Patent Primary Examiner
Edits on 29 Mar, 2023
Golden AI
Infobox
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
105867630
Date of Patent
March 10, 2020
0Patent Application Number
159665580
Date Filed
April 30, 2018
0Patent Primary Examiner
Edits on 2 Feb, 2022
Golden AI
Edits made to:
Infobox (+10 properties)
US Patent 10586763 Semiconductor device and method of manufacture
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10586763
Date of patent
March 10, 2020
Patent application number
15966558
Date Filed
April 30, 2018
Patent primary examiner
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