Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Eric A. Dauler0
Rabindra N. Das0
Date of Patent
March 10, 2020
0Patent Application Number
156842690
Date Filed
August 23, 2017
0Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
A cryogenic electronic package includes a circuitized substrate, an interposer, a superconducting multichip module (SMCM) and at least one superconducting semiconductor structure. The at least one superconducting semiconductor structure is disposed over and coupled to the SMCM, and the interposer is disposed between the SMCM and the substrate. The SMCM and the at least one superconducting semiconductor structure are electrically coupled to the substrate through the interposer. A cryogenic electronic assembly including a plurality of cryogenic electronic packages is also provided.
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