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US Patent 10586909 Cryogenic electronic packages and assemblies

Patent 10586909 was granted and assigned to Massachusetts Institute of Technology on March, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Massachusetts Institute of Technology
Massachusetts Institute of Technology
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Date Filed
August 23, 2017
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Date of Patent
March 10, 2020
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Patent Applicant
Massachusetts Institute of Technology
Massachusetts Institute of Technology
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Patent Application Number
15684269
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Patent Citations Received
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US Patent 12127484 Tunable qubit coupler
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US Patent 11493714 Quantum computing die assembly with thru-silicon vias and connected logic circuit
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US Patent 11493713 Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
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US Patent 11503701 Electronic device having heat transfer clamp and associated methods
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US Patent 11527696 Low footprint resonator in flip chip geometry
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US Patent 11665856 Electronic device having flexible, heat conductive layer and associated methods
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US Patent 11835777 Optical multi-die interconnect bridge (OMIB)
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US Patent 11892693 Photonic quantum computer assembly
0
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US Patent 12120966 Low footprint resonator in flip chip geometry
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US Patent 11482656 Tunable qubit coupler
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•••
Patent Inventor Names
Eric A. Dauler
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Rabindra N. Das
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10586909
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Patent Primary Examiner
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Cuong B Nguyen
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