Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 17, 2020
Patent Application Number
15965576
Date Filed
April 27, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
Various fan-out devices are disclosed. In one aspect, a semiconductor chip device is provided that includes a redistribution layer (RDL) structure. The RDL structure includes plural metallization layers and plural polymer layers. One of the polymer layers is positioned over one of the metallization layers. The one of the metallization layers has conductor traces. The one of the polymer layers has an upper surface that is substantially planar at least where the conductor traces are positioned. A semiconductor chip is positioned on and electrically connected to the RDL structure. A molding layer is positioned on the RDL structure and at least partially encases the semiconductor chip.
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