Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shih-Fan Kuan0
Yi-Jen Lo0
Date of Patent
March 17, 2020
0Patent Application Number
161084730
Date Filed
August 22, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip and a plurality of first connectors. The two device regions are formed from the substrate, and the first redistribution layer is disposed on the substrate and electrically connected to the two device regions. The external chip is disposed on the first redistribution layer, and the first connectors are interposed between the first redistribution layer and the external chip to interconnect the two.
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