US Patent 10593637 Multi-device packages and related microelectronic devices
Patent 10593637 was granted and assigned to Micron Technology on March, 2020 by the United States Patent and Trademark Office.
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Patent abstract
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip and a plurality of first connectors. The two device regions are formed from the substrate, and the first redistribution layer is disposed on the substrate and electrically connected to the two device regions. The external chip is disposed on the first redistribution layer, and the first connectors are interposed between the first redistribution layer and the external chip to interconnect the two.
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Patent Inventor Names
Shih-Fan Kuan0
Yi-Jen Lo0
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Patent Citations Received
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
105936370
Date of Patent
March 17, 2020
0Patent Application Number
161084730
Date Filed
August 22, 2018
0Patent Primary Examiner
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US Patent 10593637 Multi-device packages and related microelectronic devices
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10593637
Date of patent
March 17, 2020
Patent application number
16108473
Date Filed
August 22, 2018
Patent primary examiner
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