US Patent 10602639 Extension portion of heatsink above a processing component
Patent 10602639 was granted and assigned to Hewlett Packard Enterprise on March, 2020 by the United States Patent and Trademark Office.
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US Patent 10602639 Extension portion of heatsink above a processing component
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10602639
Date of patent
March 24, 2020
Patent application number
16079642
Date Filed
April 15, 2016
Patent citations
Patent primary examiner
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