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US Patent 10622593 Reduction of packaging parasitic inductance in power modules
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Edits on 21 Mar, 2024
"update inverses"
Golden AI
edited on 21 Mar, 2024
Edits made to:
Infobox
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+1
properties)
Infobox
Patent Citations Received
US Patent 11932114 Power electronics assembly having staggered and diagonally arranged transistors
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Edits on 23 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 23 May, 2023
Edits made to:
Infobox
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-1
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10622593
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Edits on 31 Mar, 2023
"Entity importer update"
Golden AI
edited on 31 Mar, 2023
Infobox
Is a
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10622593
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Date of Patent
April 14, 2020
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Patent Application Number
16000398
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Date Filed
June 5, 2018
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10622593
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Patent Citations
US Patent 10141254 Direct bonded copper power module with elevated common source inductance
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Patent Primary Examiner
Jared Fureman
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Edits on 25 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 25 Mar, 2023
Infobox
Patent Citations
US Patent 10141254 Direct bonded copper power module with elevated common source inductance
0
Edits on 28 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 28 Sep, 2022
Infobox
Patent Citations
US Patent 10141254 Direct bonded copper power module with elevated common source inductance
0
Edits on 27 Sep, 2022
"Entity importer update"
Golden AI
edited on 27 Sep, 2022
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10622593
0
Date of Patent
April 14, 2020
0
Patent Application Number
16000398
0
Date Filed
June 5, 2018
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10622593
0
Patent Citations
US Patent 10141254 Direct bonded copper power module with elevated common source inductance
0
Patent Primary Examiner
Jared Fureman
0
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10622593
Edits on 2 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 2 Feb, 2022
Edits made to:
Infobox
(
+8
properties)
US Patent 10622593 Reduction of packaging parasitic inductance in power modules
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10622593
Date of patent
April 14, 2020
Patent application number
16000398
Date Filed
June 5, 2018
Patent citations
US Patent 10141254 Direct bonded copper power module with elevated common source inductance
Patent primary examiner
Jared Fureman
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