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US Patent 10629560 Semiconductor structure
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Edits on 19 Sep, 2024
"update inverses"
Golden AI
edited on 19 Sep, 2024
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+1
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Patent Citations Received
US Patent 12094828 Eccentric via structures for stress reduction
0
Edits on 28 Dec, 2023
"update inverses"
Golden AI
edited on 28 Dec, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 11855008 Stacking via structures for stress reduction
0
Edits on 7 Sep, 2023
"update inverses"
Golden AI
edited on 7 Sep, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 11749644 Semiconductor device with curved conductive lines and method of forming the same
Edits on 7 Jun, 2023
"update inverses"
Golden AI
edited on 7 Jun, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 11670601 Stacking via structures for stress reduction
0
Edits on 25 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 25 May, 2023
Edits made to:
Infobox
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-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10629560
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Edits on 25 Mar, 2023
"Entity importer update"
Golden AI
edited on 25 Mar, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10629560
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Date of Patent
April 21, 2020
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Patent Application Number
16246564
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Date Filed
January 14, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10629560
0
Patent Citations Received
US Patent 11264359 Chip bonded to a redistribution structure with curved conductive lines
0
Patent Primary Examiner
Nathan W Ha
0
Edits on 22 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 22 Mar, 2023
Infobox
Patent Citations Received
US Patent 11264359 Chip bonded to a redistribution structure with curved conductive lines
0
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations Received
US Patent 11264359 Chip bonded to a redistribution structure with curved conductive lines
0
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10629560
Edits on 3 Mar, 2022
"update inverses"
Golden AI
edited on 3 Mar, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent citations received
US Patent 11264359 Chip bonded to a redistribution structure with curved conductive lines
Edits on 2 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 2 Feb, 2022
Edits made to:
Infobox
(
+7
properties)
US Patent 10629560 Semiconductor structure
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10629560
Date of patent
April 21, 2020
Patent application number
16246564
Date Filed
January 14, 2019
Patent primary examiner
Nathan W Ha
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