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US Patent 10629560 Semiconductor structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 14, 2019
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Date of Patent
April 21, 2020
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Patent Application Number
16246564
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Patent Citations Received
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US Patent 11749644 Semiconductor device with curved conductive lines and method of forming the same
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US Patent 11670601 Stacking via structures for stress reduction
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US Patent 12094828 Eccentric via structures for stress reduction
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US Patent 11855008 Stacking via structures for stress reduction
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US Patent 11264359 Chip bonded to a redistribution structure with curved conductive lines
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10629560
0
Patent Primary Examiner
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Nathan W Ha
0

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