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US Patent 10636765 System-in-package with double-sided molding

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

April 28, 2020

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Patent Application Number

154586490

Date Filed

March 14, 2017

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Patent Citations Received

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US Patent 11670618 System-in-package with double-sided molding

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US Patent 11854991 Semiconductor devices and methods of manufacturing semiconductor devices

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US Patent 11538801 Semiconductor package

US Patent 10797024 System-in-package with double-sided molding

US Patent 11610844 High performance module for SiP

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