Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10636765 System-in-package with double-sided molding

OverviewStructured DataIssuesContributorsActivity

All edits

Edits on 31 Jul, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 31 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
Edits on 28 Dec, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 28 Dec, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11854991 Semiconductor devices and methods of manufacturing semiconductor devices
0
Edits on 7 Jun, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 7 Jun, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11670618 System-in-package with double-sided molding
0
Edits on 21 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI profile picture
Golden AI
edited on 21 May, 2023
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=106367650
Edits on 12 Apr, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 12 Apr, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11610844 High performance module for SiP
0
Edits on 1 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 1 Apr, 2023
Infobox
Patent Citations Received
‌
US Patent 11538801 Semiconductor package
0
Edits on 27 Mar, 2023
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 27 Mar, 2023
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
106367650
Date of Patent
April 28, 2020
0
Patent Application Number
154586490
Date Filed
March 14, 2017
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=106367650
Patent Citations Received
‌
US Patent 10797024 System-in-package with double-sided molding
0
‌
US Patent 11538801 Semiconductor package
0
Patent Primary Examiner
‌
Brook Kebede
0
Edits on 28 Dec, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 28 Dec, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11538801 Semiconductor package
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 26 Sep, 2022
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10636765
Edits on 7 Feb, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 7 Feb, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 10797024 System-in-package with double-sided molding
Edits on 3 Feb, 2022
"Created via: Entity Importer"
Golden AI profile picture
Golden AI
created this topic on 3 Feb, 2022
Edits made to:
Infobox (+7 properties)
‌

 US Patent 10636765 System-in-package with double-sided molding

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10636765
Date of patent
April 28, 2020
Patent application number
15458649
Date Filed
March 14, 2017
Patent primary examiner
‌
Brook Kebede

Find more entities like US Patent 10636765 System-in-package with double-sided molding

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo