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US Patent 10714449 Die processing
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Patent
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Date Filed
July 18, 2019
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Date of Patent
July 14, 2020
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Patent Application Number
16515588
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Patent Citations
US Patent 10075657 Edgeless large area camera system
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
US Patent 10269756 Die processing
Patent Citations Received
US Patent 11855064 Techniques for processing devices
0
US Patent 10985133 Die processing
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10714449
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Patent Primary Examiner
Anthony Ho
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