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US Patent 10749103 Dry plasma etch method to pattern MRAM stack
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Edits on 29 Jul, 2023
"Resolve patent citation"
Golden AI
edited on 29 Jul, 2023
Infobox
Patent Citations Received
US Patent 11450513 Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials
0
Edits on 22 Jul, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 22 Jul, 2023
Edits made to:
Infobox
(
-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10749103
0
Edits on 27 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 27 Apr, 2023
Infobox
Patent Citations
US Patent 10374144 Dry plasma etch method to pattern MRAM stack
0
Edits on 3 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 3 Apr, 2023
Infobox
Patent Citations
US Patent 10186426 Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)
0
Edits on 1 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 1 Apr, 2023
Infobox
Patent Citations Received
US Patent 11450513 Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 26 Sep, 2022
Infobox
Patent Citations
US Patent 10374144 Dry plasma etch method to pattern MRAM stack
0
"update citations for inverse infoboxes"
Golden AI
edited on 26 Sep, 2022
Infobox
Patent Citations Received
US Patent 11069535 Atomic layer etch of tungsten for enhanced tungsten deposition fill
0
"update citations for inverse infoboxes"
Golden AI
edited on 26 Sep, 2022
Infobox
Patent Citations Received
US Patent 10998187 Selective deposition with atomic layer etch reset
0
Edits on 23 Sep, 2022
"Entity importer update"
Golden AI
edited on 23 Sep, 2022
Infobox
Is a
Patent
0
Patent Applicant
Lam Research
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Current Assignee
Lam Research
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10749103
0
Date of Patent
August 18, 2020
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Patent Application Number
16449141
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Date Filed
June 21, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10749103
0
Patent Citations
US Patent 10096487 Atomic layer etching of tungsten and other metals
0
US Patent 10186426 Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)
0
US Patent 10374144 Dry plasma etch method to pattern MRAM stack
0
Patent Citations Received
US Patent 10998187 Selective deposition with atomic layer etch reset
0
US Patent 11069535 Atomic layer etch of tungsten for enhanced tungsten deposition fill
0
US Patent 11450513 Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials
0
Patent Primary Examiner
Allan W. Olsen
0
Edits on 21 Sep, 2022
"update inverses"
Golden AI
edited on 21 Sep, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 11450513 Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials
0
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10749103
Edits on 13 Feb, 2022
"update inverses"
Golden AI
edited on 13 Feb, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent citations received
US Patent 11069535 Atomic layer etch of tungsten for enhanced tungsten deposition fill
Edits on 11 Feb, 2022
"update inverses"
Golden AI
edited on 11 Feb, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent citations received
US Patent 10998187 Selective deposition with atomic layer etch reset
Edits on 6 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 6 Feb, 2022
Edits made to:
Infobox
(
+12
properties)
US Patent 10749103 Dry plasma etch method to pattern MRAM stack
Infobox
Is a
Patent
Patent applicant
Lam Research
Current assignee
Lam Research
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10749103
Date of patent
August 18, 2020
Patent application number
16449141
Date Filed
June 21, 2019
Patent citations
US Patent 10096487 Atomic layer etching of tungsten and other metals
US Patent 10186426 Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)
US Patent 10374144 Dry plasma etch method to pattern MRAM stack
Patent primary examiner
Allan W. Olsen
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