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US Patent 10756049 Package-on-package assembly with wire bond vias

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United States Patent and Trademark Office

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Patent Number

Date of Patent

August 25, 2020

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Patent Application Number

156992880

Date Filed

September 8, 2017

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Patent Citations

US Patent 10115678 Wire bond wires for interference shielding

US Patent 10181457 Microelectronic package for wafer-level chip scale packaging with fan-out

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