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US Patent 10764990 Heat-dissipating module having an elastic mounting structure

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Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

September 1, 2020

Patent Application Number

16391963

Date Filed

April 23, 2019

Patent Citations Received

US Patent 11632860 Power electronic assembly and method of producing thereof

0

US Patent 10937717 Heatsink secured to a heat source

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