Patent attributes
Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit board has a first side and an opposite second side, a heat source located on the first side of the printed circuit board, a heatsink over the heat source, and one or more fasteners coupled to the heatsink. The one or more fasteners go through the printed circuit board and each of the one or more fasteners includes a printed circuit board securing area that extends along the second side of the printed circuit board to help secure the heatsink to the printed circuit board and create an applied load on the heat source. In an example, a thermal interface material layer less than about one hundred (100) micrometers in in thickness can be between the heat source and the heatsink.
