Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ashley J. M. Erickson
Aparna R. Prasad
Sandeep Razdan
Joyce J. M. Peternel
Matthew J. Traverso
Date of Patent
September 12, 2023
Patent Application Number
17663072
Date Filed
May 12, 2022
Patent Citations
...
Patent Primary Examiner
An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.