Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 19, 2016
Patent Application Number
14037706
Date Filed
September 26, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink.
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