US Patent 10791008 Multilevel driver for high speed chip-to-chip communications
Patent 10791008 was granted and assigned to Kandou on September, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 3, 2019
Date of Patent
September 29, 2020
Patent Applicant
Patent Application Number
16559412
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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