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US Patent 10797031 Semiconductor package

Patent 10797031 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Date Filed
September 20, 2018
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Date of Patent
October 6, 2020
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Patent Application Number
16136262
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Patent Citations Received
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US Patent 11394386 Logic drive using standard commodity programmable logic IC chips
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US Patent 11309334 Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
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US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
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US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips
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US Patent 10937736 Hybrid integrated circuit package and method
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US Patent 11600526 Chip package based on through-silicon-via connector and silicon interconnection bridge
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US Patent 11621247 Semiconductor package
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US Patent 11625523 Logic drive based on standard commodity FPGA IC chips
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US Patent 11637056 3D chip package based on through-silicon-via interconnection elevator
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US Patent 11749610 Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10797031
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Patent Primary Examiner
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Chad H Smith
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