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US Patent 10818640 Die stacks and methods forming same

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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1081864000
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https://pdfpiw.uspto.gov/.piw?Docid=10818640
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 US Patent 10818640 Die stacks and methods forming same

Infobox
Is a
Patent
Patent
Patent applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10818640
Date of patent
October 27, 2020
Patent application number
16373027
Date Filed
April 2, 2019
Patent citations
‌
US Patent 10170341 Release film as isolation film in package
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US Patent 10368442 Integrated circuit structure and method of forming
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US Patent 10522526 LTHC as charging barrier in InFO package formation
Patent primary examiner
‌
Thomas L. Dickey

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