Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jui-Pin Hung0
Chen-Hua Yu0
Kuo-Chung Yee0
Date of Patent
July 30, 2019
0Patent Application Number
149287680
Date Filed
October 30, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit structure and method of forming is provided. A die is place on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from the die. The redistribution layer is connected to a printed circuit board.
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