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US Patent 10368442 Integrated circuit structure and method of forming
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Patent
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Date Filed
October 30, 2015
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Date of Patent
July 30, 2019
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Patent Application Number
14928768
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Patent Citations Received
US Patent 12080684 Die stacks and methods forming same
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US Patent 10818640 Die stacks and methods forming same
US Patent 11380655 Die stacks and methods forming same
Patent Inventor Names
Jui-Pin Hung
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Chen-Hua Yu
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Kuo-Chung Yee
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10368442
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Patent Primary Examiner
Peter Dungba Vo
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