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US Patent 10847417 Methods of forming interconnect structures in semiconductor fabrication

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Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

November 24, 2020

Patent Application Number

16547083

Date Filed

August 21, 2019

Patent Citations Received

US Patent 11929314 Interconnect structures including a fin structure and a metal cap

0

US Patent 11257755 Metal loss prevention in conductive structures

US Patent 11631640 Metal loss prevention in conductive structures

Patent Primary Examiner

J.E. Schoenholtz

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