US Patent 10866621 Hinged dimm cooling device

Patent 10866621 was granted and assigned to Hewlett Packard Enterprise on December, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Hewlett Packard Enterprise

Current Assignee

Hewlett Packard Enterprise

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108666210

Date of Patent

December 15, 2020

Patent Application Number

162563140

Date Filed

January 24, 2019

Patent Citations

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US Patent 10021814 Cooling apparatus for computer memory

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US Patent 10705578 Heat removal from memory modules

Patent Citations Received

Patent Primary Examiner

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Hung V. Ngo

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